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Technical Evidence

The Report Holder has submitted technical documentation for the CCMC evaluation. Testing was conducted at a laboratory recognized by CCMC. The technical evidence summarized below is for waferboard panels (i.e., non-oriented wafers) manufactured with the product.

Material Requirements

Physical Properties
Table 4.1.1.1 Results of Testing the Physical Properties of the OSB Bound with Product
Property Unit Average Requirement Individual Requirement Average Result Individual Result
Modulus of rupture (MOR) after preconditioning MPa ≥17.2 ≥13.8 40.6 27.9
Modulus of elasticity (MOE) after preconditioning MPa ≥3100 ≥2480 5 076 4 107
Internal bond after preconditioning MPa ≥0.345 ≥0.276 0.877 0.729
Bond durability (MOR) after 2-h boil (tested when wet) MPa ≥8.6 ≥6.9 21.9 16.1
Bond durability (MOR) after 6 cycles MPa ≥8.6 ≥6.9 33.7 27.7
Thickness swell after 24-h soak % ≤25 ≤30 6.0 6.9
Linear expansion when oven-dry to saturated % ≤0.40 ≤0.48 0.22 0.28
Linear expansion at 50% to 90% relative humidity (RH) % ≤0.20 ≤0.24 0.10 0.13

Prescriptive Requirements

Creep Properties at 20ºC
Table 4.2.1.1 Results of Testing the Creep Properties of the OSB Bound with Product at 20ºC
Property Unit Average Requirement Individual Requirement Average Result Individual Result
Cumulative creep mm ≤1.7 ≤2.04 1.14 1.47
Secondary creep mm ≤0.4 ≤0.48 0.20 0.24
Irrecoverable creep mm ≤1.1 ≤1.32 0.66 0.82
Creep Properties at 30ºC
Table 4.2.2.1 Results of Testing the Creep Properties of the OSB Bound with Product at 30ºC
Property Unit Average Requirement Individual Requirement Average Result Individual Result
Cumulative creep mm ≤2.2 ≤2.64 1.31   1.52
Secondary creep mm ≤0.4 ≤0.48 0.16     0.19
Irrecoverable creep mm ≤1.5 ≤1.8 0.80    0.93
Creep Properties Increased at Higher Ambient Temperature (from 20ºC to 30ºC )
Table 4.2.3.1 Results of Testing the Creep Properties of the OSB Bound with Product
Property Unit Average Requirement Individual Requirement Average Result Individual Result
Cumulative creep mm ≤35 ≤42 15      3
Secondary creep mm ≤0 ≤0 −21 −21
Irrecoverable creep mm ≤50 ≤60 22    13

Performance Requirements

Retention of Properties – Modulus of Rupture (MOR)
Table 4.3.1.1 Results of Testing the MOR of the OSB Bound with Product
Property Unit Average Requirement Individual Requirement Average Result Individual Result
After 2-h boil (modified) exposure MPa ≥8.6 ≥6.9 43.3 35.7
After 6 cycles exposure MPa ≥8.6 ≥6.9 33.7 27.7
Exposure at −20ºC MPa ≥17.2 ≥13.8 48.4 38.8
After fungal exposure to Aspergillus niger v. Teigh MPa ≥13.8 ≥11.0 29.5 23.8
After fungal exposure to Penicillium luteum MPa ≥13.8 ≥11.0 31.1 18.1
After soaking in 1% hydrochloric acid MPa ≥7.7 ≥6.2 27.9 20.4
After soaking in 1% sodium hydroxide MPa ≥12.0 ≥9.6 35.9 27.5
After soaking in water MPa ≥14.6 ≥11.7 38.5 27.3
Retention of Properties – Modulus of Elasticity (MOE)
Table 4.3.2.1 Results of Testing the MOE of the OSB Bound with Product
Property Unit Average Requirement Individual Requirement Average Result Individual Result
After 2-h boil (modified) exposure MPa ≥1550 ≥1240 5 315 4 735
After 6 cycles exposure MPa ≥2015 ≥1612 4 766 4 111
Exposure at −20ºC MPa ≥3100 ≥2480 5 890 4 588
After fungal exposure to Aspergillus niger v. Teigh MPa ≥2480 ≥1984 4 386 3 101
After fungal exposure to Penicillium luteum MPa ≥2480 ≥1984 4 530 3 241
After soaking in 1% hydrochloric acid MPa ≥2480 ≥1984 4 862 3 447
After soaking in 1% sodium hydroxide MPa ≥2325 ≥1860 5 021 4 071
After soaking in water MPa ≥2790 ≥2232 5 348 4 527
Retention of Properties – Internal Bond

There is no individual result for the internal bond property given that the residual property requirements apply to the average of three test specimens for each test board.

Table 4.3.3.1 Results of Testing the Internal Bond of the OSB Bound with Product
Property Unit Average Requirement Individual Requirement Average Result Individual Result
After 2-h boil (modified) exposure MPa ≥0.104 N/A 0.511 N/A
After 6 cycles exposure MPa ≥0.035 N/A 0.281 N/A
Exposure at −20ºC MPa ≥0.345 N/A 0.784 N/A
After fungal exposure to Aspergillus niger v. Teigh MPa ≥0.207 N/A 0.617 N/A
After fungal exposure to Penicillium luteum MPa ≥0.207 N/A 0.631 N/A
After soaking in 1% hydrochloric acid MPa ≥0.069 N/A 0.410 N/A
After soaking in 1% sodium hydroxide MPa ≥0.155 N/A 0.417 N/A
After soaking in water MPa ≥0.224 N/A 0.541 N/A