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Technical Evidence
The Report Holder has submitted technical documentation for the CCMC evaluation. Testing was conducted at a laboratory recognized by CCMC. The technical evidence summarized below is for waferboard panels (i.e., non-oriented wafers) manufactured with the product.
Material Requirements
Physical Properties
Table 4.1.1.1 Results of Testing the Physical Properties of the OSB Bound with Product
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
Modulus of rupture (MOR) after preconditioning |
MPa |
≥17.2 |
≥13.8 |
40.6 |
27.9 |
Modulus of elasticity (MOE) after preconditioning |
MPa |
≥3100 |
≥2480 |
5 076 |
4 107 |
Internal bond after preconditioning |
MPa |
≥0.345 |
≥0.276 |
0.877 |
0.729 |
Bond durability (MOR) after 2-h boil (tested when wet) |
MPa |
≥8.6 |
≥6.9 |
21.9 |
16.1 |
Bond durability (MOR) after 6 cycles |
MPa |
≥8.6 |
≥6.9 |
33.7 |
27.7 |
Thickness swell after 24-h soak |
% |
≤25 |
≤30 |
6.0 |
6.9 |
Linear expansion when oven-dry to saturated |
% |
≤0.40 |
≤0.48 |
0.22 |
0.28 |
Linear expansion at
50% to
90% relative humidity (RH) |
% |
≤0.20 |
≤0.24 |
0.10 |
0.13 |
Prescriptive Requirements
Creep Properties at
20ºC
Table 4.2.1.1 Results of Testing the Creep Properties of the OSB Bound with Product at 20ºC
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
Cumulative creep |
mm |
≤1.7 |
≤2.04 |
1.14 |
1.47 |
Secondary creep |
mm |
≤0.4 |
≤0.48 |
0.20 |
0.24 |
Irrecoverable creep |
mm |
≤1.1 |
≤1.32 |
0.66 |
0.82 |
Creep Properties at 30ºC
Table 4.2.2.1 Results of Testing the Creep Properties of the OSB Bound with Product at
30ºC
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
Cumulative creep |
mm |
≤2.2 |
≤2.64 |
1.31 |
1.52 |
Secondary creep |
mm |
≤0.4 |
≤0.48 |
0.16 |
0.19 |
Irrecoverable creep |
mm |
≤1.5 |
≤1.8 |
0.80 |
0.93 |
Creep Properties Increased at Higher Ambient Temperature (from 20ºC
to 30ºC
)
Table 4.2.3.1 Results of Testing the Creep Properties of the OSB Bound with Product
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
Cumulative creep |
mm |
≤35 |
≤42 |
15 |
3 |
Secondary creep |
mm |
≤0 |
≤0 |
−21 |
−21 |
Irrecoverable creep |
mm |
≤50 |
≤60 |
22 |
13 |
Performance Requirements
Retention of Properties – Modulus of Rupture (MOR)
Table 4.3.1.1 Results of Testing the MOR of the OSB Bound with Product
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
After 2-h boil (modified) exposure |
MPa |
≥8.6 |
≥6.9 |
43.3 |
35.7 |
After 6 cycles exposure |
MPa |
≥8.6 |
≥6.9 |
33.7 |
27.7 |
Exposure at
−20ºC |
MPa |
≥17.2 |
≥13.8 |
48.4 |
38.8 |
After fungal exposure to Aspergillus niger v. Teigh |
MPa |
≥13.8 |
≥11.0 |
29.5 |
23.8 |
After fungal exposure to Penicillium luteum |
MPa |
≥13.8 |
≥11.0 |
31.1 |
18.1 |
After soaking in
1% hydrochloric acid |
MPa |
≥7.7 |
≥6.2 |
27.9 |
20.4 |
After soaking in
1% sodium hydroxide |
MPa |
≥12.0 |
≥9.6 |
35.9 |
27.5 |
After soaking in water |
MPa |
≥14.6 |
≥11.7 |
38.5 |
27.3 |
Retention of Properties – Modulus of Elasticity (MOE)
Table 4.3.2.1 Results of Testing the MOE of the OSB Bound with Product
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
After 2-h boil (modified) exposure |
MPa |
≥1550 |
≥1240 |
5 315 |
4 735 |
After 6 cycles exposure |
MPa |
≥2015 |
≥1612 |
4 766 |
4 111 |
Exposure at
−20ºC |
MPa |
≥3100 |
≥2480 |
5 890 |
4 588 |
After fungal exposure to Aspergillus niger v. Teigh |
MPa |
≥2480 |
≥1984 |
4 386 |
3 101 |
After fungal exposure to Penicillium luteum |
MPa |
≥2480 |
≥1984 |
4 530 |
3 241 |
After soaking in
1% hydrochloric acid |
MPa |
≥2480 |
≥1984 |
4 862 |
3 447 |
After soaking in
1% sodium hydroxide |
MPa |
≥2325 |
≥1860 |
5 021 |
4 071 |
After soaking in water |
MPa |
≥2790 |
≥2232 |
5 348 |
4 527 |
Retention of Properties – Internal Bond
There is no individual result for the internal bond property given that the residual property requirements apply to the average of three test specimens for each test board.
Table 4.3.3.1 Results of Testing the Internal Bond of the OSB Bound with Product
Property |
Unit |
Average Requirement |
Individual Requirement |
Average Result |
Individual Result |
After 2-h boil (modified) exposure |
MPa |
≥0.104 |
N/A |
0.511 |
N/A |
After 6 cycles exposure |
MPa |
≥0.035 |
N/A |
0.281 |
N/A |
Exposure at
−20ºC |
MPa |
≥0.345 |
N/A |
0.784 |
N/A |
After fungal exposure to Aspergillus niger v. Teigh |
MPa |
≥0.207 |
N/A |
0.617 |
N/A |
After fungal exposure to Penicillium luteum |
MPa |
≥0.207 |
N/A |
0.631 |
N/A |
After soaking in
1% hydrochloric acid |
MPa |
≥0.069 |
N/A |
0.410 |
N/A |
After soaking in
1% sodium hydroxide |
MPa |
≥0.155 |
N/A |
0.417 |
N/A |
After soaking in water |
MPa |
≥0.224 |
N/A |
0.541 |
N/A |